The evolution of embedded applications design revolves around two criteria: higher data rates and increased wireless connectivity. High-speed digital busses and RF signal paths are often in close proximity. High-precision analog and high-power signals may also be present. Electrical engineers, PCB designers and EMI/EMC engineers must design electronic systems and subsystems to minimize electromagnetic emission and maximize electromagnetic immunity.

In this technical presentation, practical design techniques and guidelines will be presented to help optimize EMI/EMC. Innovative interconnect solutions designed for optimized EMI/EMC performance will also be highlighted.