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Signal Integrity Basics for High-Speed Embedded Applications

/Veranstaltungen/Signal Integrity Basics for High-Speed Embedded Applications

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Thema

Signal Integrity Basics for High-Speed Embedded Applications

Datum und Uhrzeit

Mittwoch, 09.02.2022 | 15:00 -16:00 Uhr

Speaker/Presenter

Matthew Burns
Technical Marketing Manager
Samtec
 
Matthew Burns develops go-to-market strategies for Samtec’s Silicon to Silicon solutions. Over the course of 20+ years, he has been a leader in design, technical sales and marketing in the telecommunications, medical and electronic components industries. Mr. Burns holds a B.S. in Electrical Engineering from Penn State University.

Abstract

Current and next-generation embedded computing platforms feature high-speed protocols such as PCI Express® 4.0/5.0, 100 GbE and USB4™. System architects, electrical engineers and PCB designers are challenged as never before to route high-speed signals in dense, scalable small form factors. Technical design decisions ranging from PCB stack-up and laminate selection to weave patterns, break out regions and via placement all influence channel-wide signal integrity.

In this technical presentation, practical signal integrity considerations and design techniques will be presented to help simplify the high-speed design process. Full channel optimization strategies, component selection and emerging system architectures will also be highlighted.

Anschließend und während des Webinars besteht die Möglichkeit Fragestellungen aufzunehmen und zu beantworten.

Das Webinar wird in englischer Sprache abgehalten.

Anmeldeschluss: 08.02.2022

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